Automatic Solder Joint Inspection System by X-ray Imaging.
نویسندگان
چکیده
منابع مشابه
Automatic inspection of surface mount solder joints using X-ray images
Surface Mount Technology (used in manufacture of the IBM PS/2) allows great flexibility in layout and very rapid assembly of densely populated circuit boards. The technique presents problems however in the positioning, soldering and testing of chips with very small gaps between leads (10 thousandths of an inch). Anticipated future improvements in the technology will make, conventional visual an...
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Purpose: Computer vision has been widely used in the inspection of electronic components. This paper proposes a computer vision system for the automatic detection, localisation, and segmentation of solder joints on Printed Circuit Boards (PCBs) under different illumination conditions. Design/methodology/approach: An illumination normalization approach is applied to an image, which can effective...
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A new algorithm for 3D-reconstruction of objects from x-ray projections, called Planar Computer Tomography (PCT), is applied to inspection of solder joints. In contrast to axial computer tomography reconstruction is based on linear object movements instead of axial rotation. By this the handling of the Printed Circuit Board is simplified and integration into the conventional x-ray inspection pr...
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An optical solder joint inspection system(0SIIS) has been developed for the automatic visual inspection of soldered parts on the printed circuit boards. Its advantages over existing techniques include the detection of 3-0 shape of specular objects with high reliable and high speed. In this paper, we will propose a solder joint inspection scheme for a prototype of the OUIS. The inspection scheme...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 1993
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.59.65